High-temperature chemical vapor deposition. An effective tool for the production of coatings

Wahl, G.; Stadel, O.; Gorbenko, O.; Kaul, A.

doi:10.1351/pac200072112167

Pure Appl. Chem., 2000, Vol. 72, No. 11, pp. 2167-2175

http://dx.doi.org/10.1351/pac200072112167

High-temperature chemical vapor deposition. An effective tool for the production of coatings

G. Wahl¹*, O. Stadel¹, O. Gorbenko² and A. Kaul²

¹ Institut für Oberflächentechnik und Plasmatechnische Werkstoffentwicklung, Technische Universität Braunschweig, Bienroder Weg 53, D 38108 Braunschweig, Germany
² Moscow State University, Chemistry Department, Moscow 119899, Russia

Abstract: Chemical vapor deposition (CVD) processes have a large throwing power and can operate at atmospheric pressure. Therefore, they are economical for many applications. High-temperature CVD processes give a good control of the crystal structure (e.g., epitaxial layers or other special layer structures) and support diffusion processes. The are used, for example, for the following deposition processes: 1) perovskites, 2) yttrium-stabilized ZrO₂layers as ion conductors or heat barrier coatings, 3) aluminide diffusion coatings in long tubes for corrosion protection, and 4) BN on fibers for fiber-reinforced materials. The special properties of the perovskite CVD are discussed in more detail. These processes are described for small- and large-scale applications. The CVD process is simulated by the computer code Fluent.